| Date | HS Code | Product Description | Origin Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
|---|---|---|---|---|---|---|---|---|---|
| 13/Mar/2020 | 38249999 | OCHW00012 # & BMS-903A solution for removing copper layer on wafer surface after UV irradiation Ingredients: Sulfinylbismethane 81 ~ 90%, 1,2-Ethanediol 5 ~ 15%, Water 1 ~ 5%, Tetramethylammonium hydroxide 1 ~ 5% | Korea (Republic) | liter | 480.00 | 12,840.00 | 26.75 | View Importer | View Supplier |
