| 31/Jan/2019 | 38159000 | Cataposit (TM) 44 Catalyst - contains water 65-75%; Hydrochloric acid 5- <10%; Stannous chloride 10-20%; Palladium chloride 0 , 1-1% is used as a catalyst in plating industry (20L / T-272.8kg) | Japan | Lit | 220.00 | 59,532.00 | 270.60 | View Importer | View Supplier |
| 31/Jan/2019 | 38101000 | Metal surface cleaning product TL-105 (main ingredients include Tetrafluoroboric acid , Borontrifluoride , Hexafluorosilicate sodium , thiourea ... in water , liquid) | Japan | Lit | 20.00 | 2,229.94 | 111.50 | View Importer | View Supplier |
| 31/Jan/2019 | 38101000 | Acid Cleaner TM 1022-B solution contains 70-80% water; Glycolic acid 10-20%; phosphonic acid derivative 1-10%; Organic Salt 1-5%; Nonionic surfactant 1-5% (20L / T) | Japan | Lit | 300.00 | 2,949.00 | 9.83 | View Importer | View Supplier |
| 31/Jan/2019 | 38220090 | The reagent for measuring pH (BUFFER SOLUTION (A)) is used for fault analysis room in manufacturing Buffer solution , 100% new | Japan | Lit | 10.00 | 477.60 | 47.76 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | 3 # & CM-00111: Solvent ICP Nicoron FPF-2SV (C3H9NO3: 12% , NaH2PO2.H2O 40% , 48% Water) for nickel plating line | Japan | Lit | 400.00 | 3,716.65 | 9.29 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | 3 # & CM-00115: Solvent ICP Nicoron FPF-MS (C4H12N2O5 37%; NaH2PO2.H2O: 12% , 51% water) for nickel plating line | Japan | Lit | 480.00 | 4,028.51 | 8.39 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20L / T) | Japan | Lit | 500.00 | 10,440.00 | 20.88 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 500.00 | 6,625.00 | 13.25 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Crimson Converter 5410 (TM) is a solution containing Sulfuric Acid 30-40% , Glycerine 5-15% , Hydroxylamine Sulfate 1-10% used in plating industry (20L / T-680kg) | Japan | Lit | 500.00 | 5,230.00 | 10.46 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 60.00 | 754.20 | 12.57 | View Importer | View Supplier |
| 30/Jan/2019 | 38101000 | Acid Cleaner TM 1022-B solution contains 70-80% water; Glycolic acid 10-20%; phosphonic acid derivative 1-10%; Organic Salt 1-5%; Nonionic surfactant 1-5% used in electronics industry | Japan | Lit | 3,200.00 | 17,623.60 | 5.51 | View Importer | View Supplier |
| 30/Jan/2019 | 38109000 | 0171-2 # & Surfactant used in plating - GLICOAT - SMND F2 (LX) (containing Acetic acid CH3COOH) | Japan | Lit | 640.00 | 9,273.11 | 14.49 | View Importer | View Supplier |
| 30/Jan/2019 | 38140000 | # & Solvent TH-18 (Organic compound containing methyl ethyl ketone 90-95%. 100% brand new) | Japan | Lit | 80.00 | 2,875.98 | 35.95 | View Importer | View Supplier |
| 30/Jan/2019 | 38140000 | # & Solvent TH-73 (Organic compound containing methyl ethyl ketone 70-100%. New product 100%) | Japan | Lit | 10.00 | 395.64 | 39.56 | View Importer | View Supplier |
| 30/Jan/2019 | 38140000 | . & Wash liquid CL-88 (Organic compound containing methyl ethyl ketone 90-95%. 100% brand new) | Japan | Lit | 10.00 | 123.09 | 12.31 | View Importer | View Supplier |
