| 31/Jan/2019 | 38249999 | 3 # & CM-00111: Solvent ICP Nicoron FPF-2SV (C3H9NO3: 12% , NaH2PO2.H2O 40% , 48% Water) for nickel plating line | Japan | Lit | 400.00 | 3,716.65 | 9.29 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | 3 # & CM-00115: Solvent ICP Nicoron FPF-MS (C4H12N2O5 37%; NaH2PO2.H2O: 12% , 51% water) for nickel plating line | Japan | Lit | 480.00 | 4,028.51 | 8.39 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20L / T) | Japan | Lit | 500.00 | 10,440.00 | 20.88 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 500.00 | 6,625.00 | 13.25 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Crimson Converter 5410 (TM) is a solution containing Sulfuric Acid 30-40% , Glycerine 5-15% , Hydroxylamine Sulfate 1-10% used in plating industry (20L / T-680kg) | Japan | Lit | 500.00 | 5,230.00 | 10.46 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 60.00 | 754.20 | 12.57 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | Chemical KG-545Y contains Ethylene di-amine tetra-acetic acid (C10H16N2O8) 1% and Organic acid 50% are chemicals used in the plating industry of Nickel (20 Liters / Can) - 100% new goods | Japan | Lit | 80.00 | 840.16 | 10.50 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CuSO4 cleaning solution adheres to copper after product Copper Gleam HVS-202B (J) (water 85-95%; Polyalkylene glycol 5-15%; Polymer 1-5%; Sulfuric acid 0 , 1-1 %; Copper sulfate 0 , 1-1%) | Japan | Lit | 640.00 | 14,377.74 | 22.47 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | Copper Gleam HVS-202A (J) copper-brightened surface brightening solution (water 90-99%; Formaldehyde 0 , 1-1%; Organic sulfur compound 0 , 1-1%; Sulfuric acid 0 , 1 -1%; Copper sulfate 0 , 1-1%) | Japan | Lit | 320.00 | 5,019.96 | 15.69 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | Crimson Converter 5410 is a solution containing Sulfuric Acid 30-40% , Glycerine 5-15% , Hydroxylamine Sulfate 1-10% used in plating industry | Japan | Lit | 1,280.00 | 10,186.13 | 7.96 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | Cleaner Conditioner (TM) XP2285 is Monoethanolamine 1 - 10% , Non-ionic surfactant 1 - 5% , Triethanolamine 1 - 5% , Organic compound <1% , Diethanolamine <1% used in plating industry | Japan | Lit | 2,160.00 | 10,412.99 | 4.82 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 1,280.00 | 51,013.10 | 39.85 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 1,100.00 | 7,091.95 | 6.45 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CO GLEAM HVS-202AN (J) (VN) / 20L without Water 90 - 99% , Organic sulfur compound> 0 , 1- <1% , Copper sulfate> 0 , 1- <1% , Formaldehyde> 0 , 1- <1%. Improve plating capabilities in batches , increase the surface gloss of the boards | Japan | Lit | 680.00 | 10,457.34 | 15.38 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CO GLEAM HVS-202BN (J) (VN) / 20L water-free 85- 95% , Polyalkylene glycol 5-15% , Polymer 1- 5% , Sulfuric acid> 0 , 1- <1% , Copper Sulfate> 0 , 1- <1%. improve plating capabilities in batches , increase board surface flatness | Japan | Lit | 200.00 | 4,688.63 | 23.44 | View Importer | View Supplier |
