| 28/Mar/2020 | 35061000 | B10 # & Resin = Glue = glue (1 tube = 15/20/35 grams) | Korea (Republic) | g | 4,000.00 | 25,606.00 | 6.40 | View Importer | View Supplier |
| 28/Mar/2020 | 35061000 | B10 # & Resin = Glue = glue (1 tube = 15/20/35 grams) | Korea (Republic) | g | 2,600.00 | 8,733.40 | 3.36 | View Importer | View Supplier |
| 28/Mar/2020 | 35061000 | B10 # & Resin = Glue = glue (1 tube = 15/20/35 grams) | Korea (Republic) | g | 3,500.00 | 12,251.75 | 3.50 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | S010 # & Glue is derived from epoxy resin (Epoxy_1 (Ablebond 2035SC) (1 box = 100grams) | Korea (Republic) | g | 800.00 | 8.00 | 0.01 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | HSV04 # & BOND_AD1392 Glue for attaching mobile phone camera components components Modified epoxy resin, Curing Agent, Calcite, Fumed silica, Silicone (100% new) | Korea (Republic) | g | 3,690.00 | 8,253.00 | 2.24 | View Importer | View Supplier |
| 25/Mar/2020 | 35069900 | 321290H # & Prepared 321290H Glue, tp: Acrylate resin 50-70%, Acrylate monomer 20-40%, Fumed silica 4-10%; Photo initiator 1-5% | Korea (Republic) | g | 1,166.00 | 1,768.82 | 1.52 | View Importer | View Supplier |
| 25/Mar/2020 | 35069900 | 06-00-BON-00009 # & Epoxy Glue UV_AD-1331FL 06-00-BON-00009 (Ingredients: Modified epoxy resin; Polythiol resin; Calcite CCaO3). New 100% | Korea (Republic) | g | 1,000.00 | 2,636.36 | 2.64 | View Importer | View Supplier |
| 25/Mar/2020 | 35069900 | 06-00-BON-00010 # & Epoxy Glue 4051F_Thermal Cure 06-00-BON-00010 (Ingredients: Epoxy resin C18H22O3; Modified epoxy resin; Hydrated Alumina AlH3O3). New 100% | Korea (Republic) | g | 2,740.00 | 12,000.00 | 4.38 | View Importer | View Supplier |
| 24/Mar/2020 | 35069900 | E-5913L000 # & UV Epoxy HI-UV5913L: HI-UV5913L type glue made from Epoxy resin attaching plastic details on PCB printed circuit board | Korea (Republic) | g | 516.00 | 635.71 | 1.23 | View Importer | View Supplier |
| 24/Mar/2020 | 35069900 | UE32HI03 # & 9555B-6 type glue made from Epoxy resin used to attach the printed circuit protection parts | Korea (Republic) | g | 1,764.00 | 1,150.13 | 0.65 | View Importer | View Supplier |
| 24/Mar/2020 | 35069900 | UE32DH03 # & Glue made from Epoxy resin type DHUV-7067-03, used in the manufacture of electronic components | Korea (Republic) | g | 630.00 | 1,368.99 | 2.17 | View Importer | View Supplier |
| 24/Mar/2020 | 35069900 | HSV04 # & Glue used to attach mobile phone camera components BOND_UV3209M (30cc), composition Urethane acrylate resin, Acrylate resin, Fumed silica, manufacturer: EICT Korea Co., Ltd (100% new) | Korea (Republic) | g | 12,000.00 | 7,090.20 | 0.59 | View Importer | View Supplier |
| 20/Mar/2020 | 35069900 | 06-00-BON-00012 # & Epoxy Glue AD1046-EPOXY 06-00-BON-00012 (Ingredients: Modified epoxy resin; Polythiol resin; Calcite CCaO3). New 100% | Korea (Republic) | g | 5,475.00 | 9,545.44 | 1.74 | View Importer | View Supplier |
| 20/Mar/2020 | 35069900 | 06-00-BON-00005 # & Epoxy Glue SEALENT_UV_PT-1050CT 06-00-BON-00005 (Ingredients: Polyurethane acrylate resin; Isobonyl Acrylate; SILICA, QUARTZ). New 100% | Korea (Republic) | g | 3,000.00 | 5,454.54 | 1.82 | View Importer | View Supplier |
| 19/Mar/2020 | 35069900 | HSV04 # & Glue SA2235-V05 with Epoxy resin (MW 700), [3- (2,3-epoxypropoxy) propyl] trimethoxysilane | Korea (Republic) | g | 200.00 | 20.00 | 0.10 | View Importer | View Supplier |
