| 30/Mar/2020 | 35061000 | SK019 # & Prepared glue G0081, 30g / pcs, tp: High Boiling (Meth) acrylate monomers 10-30%, Polyurethane Acrylate Resin 30-60%, Proprietary adhension system 10-30%, 322000600347 | China | g | 3,000.00 | 2,124.05 | 0.71 | View Importer | View Supplier |
| 30/Mar/2020 | 35061000 | SK019 # & Prepared glue G0152, 930g / pcs, tp: Acrylate resin 20-100%, 2-ethylhexyl acrylate 20-90%, 322000600448 | China | g | 1,860.00 | 1,074.35 | 0.58 | View Importer | View Supplier |
| 28/Mar/2020 | 35061000 | B10 # & Resin = Glue = glue (1 tube = 15/20/35 grams) | Korea (Republic) | g | 4,000.00 | 25,606.00 | 6.40 | View Importer | View Supplier |
| 28/Mar/2020 | 35061000 | B10 # & Resin = Glue = glue (1 tube = 15/20/35 grams) | Korea (Republic) | g | 2,600.00 | 8,733.40 | 3.36 | View Importer | View Supplier |
| 28/Mar/2020 | 35061000 | B10 # & Resin = Glue = glue (1 tube = 15/20/35 grams) | China | g | 910.00 | 2,035.22 | 2.24 | View Importer | View Supplier |
| 28/Mar/2020 | 35061000 | B10 # & Resin = Glue = glue (1 tube = 15/20/35 grams) | Korea (Republic) | g | 3,500.00 | 12,251.75 | 3.50 | View Importer | View Supplier |
| 28/Mar/2020 | 35069900 | TPVB01 # & Glue YO-P88 (DX-P88) (Chloride Propylene Resin 7-11%, Petroleum Resin 2-5%, Toluene 60-70%, Methyl Ethyl Ketone 20-30%) new products 100% | China | g | 34,000.00 | 451.18 | 0.01 | View Importer | View Supplier |
| 27/Mar/2020 | 35069100 | AS760448 # & UV RESIN Glue (LCR-0635) used to attach cable core (50 gram / pce) | Japan | g | 150.00 | 673.95 | 4.49 | View Importer | View Supplier |
| 27/Mar/2020 | 35069100 | AHD-DB-1137B # & Glue DB-1137B (Thermoplastic rubber 10-20%, Synthetic Resin 10-20%, Carbon black 0-10%, High boiling solvent 10-20%, Methylcyclohexane 20-30%, Ethylacetate 20- 30%), New 100%, M02-73529 | Japan | g | 30,000.00 | 621.00 | 0.02 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 1,500.00 | 150.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 1,120.00 | 112.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 480.00 | 48.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 3,600.00 | 360.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | S010 # & Glue is derived from epoxy resin (Epoxy_1 (Ablebond 2035SC) (1 box = 100grams) | Korea (Republic) | g | 800.00 | 8.00 | 0.01 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | HSV04 # & BOND_AD1392 Glue for attaching mobile phone camera components components Modified epoxy resin, Curing Agent, Calcite, Fumed silica, Silicone (100% new) | Korea (Republic) | g | 3,690.00 | 8,253.00 | 2.24 | View Importer | View Supplier |
