30/Mar/2020 | 35069900 | 2451882500 HOTMELT M800G thermal glue (Titanium dioxide 4%, Calcium oxide 3%, C5 / C9 petroleum resin 41%, Styrene-butadien rubber series 40%) (17kg / carton). New 100%. | Japan | kg | 2,295.00 | 14,118.20 | 6.15 | View Importer | View Supplier |
30/Mar/2020 | 35069900 | 6351997900 HOTMELT M-555-GE thermal glue (Titanium dioxide 1%, Calcium oxide 3%, C5 / C9 petroleum resin 49%, Styrene-butadien rubber series 33%) (17kg / carton). New 100%. | Japan | kg | 765.00 | 4,651.50 | 6.08 | View Importer | View Supplier |
27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 1,500.00 | 150.00 | 0.10 | View Importer | View Supplier |
27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 1,120.00 | 112.00 | 0.10 | View Importer | View Supplier |
27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 480.00 | 48.00 | 0.10 | View Importer | View Supplier |
27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 3,600.00 | 360.00 | 0.10 | View Importer | View Supplier |
27/Mar/2020 | 35069900 | NW104 # & Bond Glue 7 (Including: ACRYLIC ACID, ALKYL ACRYLATE COPOLYMER 25-30%, HEPTANE 1-5%, HEXANE 1-5%, PHENOL-ALPHA-PINENE RESIN 10-15%, ..., Net weight: 1800G / carton) | Japan | kg | 126.00 | 2,494.80 | 19.80 | View Importer | View Supplier |
27/Mar/2020 | 35069900 | SHIV-00000265 # & Glue seal the product crack during processing Three bond TB1206D (250g / tube) (1tuyp = 1chiec) (the composition contains 5% Titanium dioxide and 95% silicon resin) | Japan | piece/pcs | 50.00 | 1,509.96 | 30.20 | View Importer | View Supplier |
26/Mar/2020 | 35069900 | 0201-003047 # & GLUE GLUE AE-421D (CONTAINING Bisphenol F epoxy resin 25-355, Epoxy resin hardener 25-35%) MOUNTING LIGHT FILTERS AND TRANSMISSORS | Japan | g | 2,800.00 | 8,947.49 | 3.20 | View Importer | View Supplier |
25/Mar/2020 | 35069900 | 3 # & Glue for gluing glass to TSE397-C components (100g / tube) Resin TSE397-C (100g) | Japan | piece/pcs | 30.00 | 331.05 | 11.03 | View Importer | View Supplier |
25/Mar/2020 | 35069900 | 3 # & glue attaching UV resin components A-1656C | Japan | piece/pcs | 30.00 | 1,602.02 | 53.40 | View Importer | View Supplier |
24/Mar/2020 | 35069900 | HSV04 # & Glue 19A008-TR1 for attaching mobile phone camera components components Acrylic esters, Synthetic resins, Silica (amorphous) packaging: 10g / 1 vial (100% new) | Japan | g | 50.00 | 3.00 | 0.06 | View Importer | View Supplier |
24/Mar/2020 | 35069900 | HSV04 # & Glue 19A008-TR3 for attaching mobile phone camera components components Acrylic esters, Synthetic resins, Silica (amorphous) packaging: 10g / 1 vial (100% new) | Japan | g | 50.00 | 3.00 | 0.06 | View Importer | View Supplier |
23/Mar/2020 | 35069900 | 2451882500 HOTMELT M800G thermal glue (Titanium dioxide 4%, Calcium oxide 3%, C5 / C9 petroleum resin 41%, Styrene-butadien rubber series 40%) (17kg / carton). New 100%. | Japan | kg | 1,258.00 | 7,857.75 | 6.25 | View Importer | View Supplier |
23/Mar/2020 | 35069900 | 6351997900 HOTMELT M-555-GE thermal glue (Titanium dioxide 1%, Calcium oxide 3%, C5 / C9 petroleum resin 49%, Styrene-butadien rubber series 33%) (17kg / carton). New 100%. | Japan | kg | 748.00 | 4,618.00 | 6.17 | View Importer | View Supplier |